The Crydom HSP-1 thermal pad is a non-adhesive thermal interface material designed for use between single-phase panel-mount solid state relays and their heatsinks. Measuring 57.15 x 44.45 x 0.076mm, the pad provides effective heat transfer with a thermal conductivity of 1 W/m.K and thermal impedance of 0.03 degrees C/W, serving as a clean and convenient alternative to thermal grease.
Suitable for use with single-phase panel-mount SSRs, control modules, and M50 power modules. Operating temperature range of -55 to 150 degrees C. Manufactured by Sensata Technologies under the Crydom brand.
PRODUCT CODE
THERMAL PAD
Brand
Crydom
Type
Thermal Interface Pad
Dimensions
57.15 x 44.45 x 0.076mm
Thermal Conductivity
1 W/m.K
Thermal Impedance
0.03 C/W
Temperature Range
-55 to 150 C
Application
Single-phase panel-mount SSRs, control modules, M50 power modules
Crydom Thermal Pad – Single Phase Hockey Puck SSR
Description
The Crydom HSP-1 thermal pad is a non-adhesive thermal interface material designed for use between single-phase panel-mount solid state relays and their heatsinks. Measuring 57.15 x 44.45 x 0.076mm, the pad provides effective heat transfer with a thermal conductivity of 1 W/m.K and thermal impedance of 0.03 degrees C/W, serving as a clean and convenient alternative to thermal grease.
Suitable for use with single-phase panel-mount SSRs, control modules, and M50 power modules. Operating temperature range of -55 to 150 degrees C. Manufactured by Sensata Technologies under the Crydom brand.
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